Copper Powder
Cu
7440-50-8
7440-50-8
| Product | Product Code |
Order or Specifications |
99% Copper Powder |
CU-M-02-P |
 |
99.9% Copper Powder |
CU-M-03-P |
|
99.99% Copper Powder |
CU-M-04-P |
|
99.999% Copper Powder |
CU-M-05-P
|
|
American Elements specializes in producing high purity Copper Powder with the smallest possible average grain sizes for use in preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles (See also Nanotechnology Information and Quantum Dots) also produce very high surface areas. Our standard Powder particle sizes average in the range of - 325 mesh, - 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range. See research below. We also produce Copper as rod, ingot, pieces, pellets, disc, granules, wire, and in compound forms, such as oxide. Other shapes are available by request.
Copper is a Block D, Group 11, Period 4 element. The electronic configuration is [Ar] 3d10 4s1. In its elemental form copper's CAS number is 7440-50-8. The copper atom has a radius of 127.8 .pm and it's Van der Waals radius is 140.pm.
| Formula | CAS No. | Appearance | Molecular Weight |
| Cu | 7440-50-8 | Reddish Metal | 63.55 |
| CATALOGUE PRODUIT | Submicroniques et nanopoudres | Tolling | Ultra haute pureté | Sputtering Public | Crystal Growth | Rod, Plate, poudre, etc. |
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